Document Type

Report

Date

5-9-2011

Embargo Period

4-26-2012

Keywords

Ansoft HFSS, ANSYS, finite-element method, packaging, surface-loss density, thermal analysis, volume-loss density

Language

English

Disciplines

Computer Sciences

Description/Abstract

In this work, rigorous thermal analysis is done for the first time based on the link between Ansoft HFSS and ANSYS. High-frequency results obtained from HFSS including surface loss density and volume loss density are imported into ANSYS. The thermal analysis run into ANSYS incorporates accurately the non-uniform power distribution in the microwave structure and hence predicts very well the thermal map for high-power applications. Experimental results confirm the developed approach.

Source

local

Share

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