Document Type
Report
Date
5-9-2011
Keywords
Ansoft HFSS, ANSYS, finite-element method, packaging, surface-loss density, thermal analysis, volume-loss density
Language
English
Disciplines
Computer Sciences
Description/Abstract
In this work, rigorous thermal analysis is done for the first time based on the link between Ansoft HFSS and ANSYS. High-frequency results obtained from HFSS including surface loss density and volume loss density are imported into ANSYS. The thermal analysis run into ANSYS incorporates accurately the non-uniform power distribution in the microwave structure and hence predicts very well the thermal map for high-power applications. Experimental results confirm the developed approach.
Recommended Citation
EL Sabbagh, Mahmoud, "Electromagnetic-Thermal Analysis Study Based on HFSS-ANSYS Link" (2011). Electrical Engineering and Computer Science - Technical Reports. 46.
https://surface.syr.edu/eecs_techreports/46
Source
local
